| Mfg Part Number: EDI81256P55QB | NSN : 5962-01-330-7857 | NIIN : 013307857 | CAGE Code : 61772 | Manufacturer: Integrated Device Technology Inc | Item Name : Microcircuit Memory | FSC : 5962 Microcircuits Electronic |
Microcircuit Memory013307857 Thank you for your interest in the various NSN parts and components that we offer on Hardware Domain. NSN 5962-01-330-7857 is listed alongside the part number EDI81256P55QB, having been manufactured by Integrated Device Technology Inc. If you would like to procure NSN part EDI81256P55QB, or other items related to Microcircuit Memory, we invite you to first begin with a quote for your comparisons which you may receive by completing the RFQ form that is provided below. When completing our form, we ask that you offer us as many details as you can regarding your needs so that we may craft a solution that is individually personalized.
This Integrated Device Technology Inc part EDI81256P55QB was produced under the CAGE Code 61772, which ensures that you are procuring exactly what you require. To guarantee the quality of our offerings, we enact a strict NO CHINA SOURCING pledge and subject countless items to rigorous quality assurance measures as necessary. As a culmination of our efforts in terms of quality control and export compliance, we are proud to operate with AS9120B, ISO 9001:2015, and FAA AC 00-56B certification and accreditation. Complete an RFQ form today for NSN 5962-01-330-7857 or get in contact with one of our representatives to see how Hardware Domain can fulfill all your part requirements with ease.
| NSN | FSC | NIIN | CLS | Hazmat | DEMIL | Cancelled NSN |
|---|---|---|---|---|---|---|
| 5962-01-330-7857 Item Description: Microcircuit Memory | 5962 | 013307857 | 0 | N | B | |
| CIIC | HCC | ESD | PMIC | Criticality | ENAC | |
| U | B | A | 0 | |||
| Part Number | ISC | RNVC | RNCC | HCC | MSDS | SADC |
| Edi81256p55qb | 2 | 9 | 5 |
| MRC | Criteria | Characteristic |
|---|---|---|
| ADAQ | BODY LENGTH | 1.250 INCHES MAXIMUM |
| ADAU | BODY HEIGHT | 0.185 INCHES MAXIMUM |
| AEHX | MAXIMUM POWER DISSIPATION RATING | 1.0 MILLIWATTS |
| AFGA | OPERATING TEMP RANGE | -55.0 TO 125.0 DEG CELSIUS |
| CQSJ | INCLOSURE MATERIAL | CERAMIC |
| CQSZ | INCLOSURE CONFIGURATION | DUAL-IN-LINE |
| CQWX | OUTPUT LOGIC FORM | COMPLEMENTARY-METAL OXIDE-SEMICONDUCTOR LOGIC |
| CQZP | INPUT CIRCUIT PATTERN | 18 INPUT |
| CTFT | CASE OUTLINE SOURCE AND DESIGNATOR | D-9 MIL-M-38510 |
| CWSG | TERMINAL SURFACE TREATMENT | SOLDER |
| CZEN | VOLTAGE RATING AND TYPE PER CHARACTERISTIC | 7.0 VOLTS MAXIMUM POWER SOURCE |
| CZER | MEMORY DEVICE TYPE | ROM |
| TEST | TEST DATA DOCUMENT | 96906-MIL-STD-883 STANDARD (INCLUDES INDUSTRY OR ASSOCIATION STANDARDS, INDIVIDUAL MANUFACTUREER STANDARDS, ETC.). |
| CBBL | FEATURES PROVIDED | MONOLITHIC AND LOW POWER AND STATIC OPERATION |
| ADAT | BODY WIDTH | 0.310 INCHES MAXIMUM |
| AFJQ | STORAGE TEMP RANGE | -65.0 TO 150.0 DEG CELSIUS |
| TTQY | TERMINAL TYPE AND QUANTITY | 24 PRINTED CIRCUIT |
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